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Report

U.S.–India AI and Emerging Technology Compact

This SCSP–ORF America report proposes a four-pillar U.S.–India compact for AI applications, infrastructure, talent, and policy to deepen bilateral cooperation and shape trusted global technology ecosystems.

Authors
Special Competitive Studies Project
Published
February 10, 2026
Length
21 pages
Reading time
13 min read
Key Findings
  • The compact organizes U.S.–India AI and emerging technology cooperation around four pillars: accelerating applications, building AI infrastructure, training talent, and aligning policy and standards.
  • SCSP and ORF America state that the recommendations draw from dialogue convenings with more than 120 experts across four days in Washington, D.C., and Delhi.
  • The applications pillar recommends a public-private U.S.–India AI Coalition, joint AI cyber threat-sharing, digital public infrastructure integration, and AI integration into defense dialogues, capability development, and exercises.
  • The infrastructure pillar calls for a full-stack AI infrastructure and technology program, semiconductor policy coordination, joint financing, streamlined project clearances in India, and a supply chain for refurbished U.S. GPUs.
  • The talent pillar recommends annual AI labor-market mapping, mutually recognized AI talent certification, binational training and apprenticeship networks, and a U.S.–India research and innovation accelerator linking universities, labs, and incubators across both countries.
Overview

This report by SCSP and ORF America sets out a proposed U.S.–India AI and Emerging Technology Compact organized around four pillars: applications, AI infrastructure, talent, and policy standards. It argues that the United States and India have complementary strengths, with U.S. leadership in frontier AI research, semiconductor design, models, and compute, and India’s scale in STEM talent, data, market demand, deployment environments, and digital public infrastructure. The recommendations are described as the culmination of dialogue convenings with more than 120 experts over four days in Washington, D.C., and Delhi. The report recommends creating a public-private U.S.–India AI Coalition, streamlining AI cybersecurity cooperation, strengthening digital public infrastructure linkages, and integrating AI into defense dialogues and exercises. It also proposes coordinated full-stack AI infrastructure exports, semiconductor policy synchronization, joint financing, faster Indian permitting, and a refurbished GPU supply chain. On talent and policy, it calls for annual labor-market mapping, standardized certification, binational training networks, a research accelerator, AI standards coordination, data-sharing frameworks, an intellectual-property compact, public trust work, and a unified compliance portal. The report frames these steps as relevant to bilateral engagement, Quad coordination, and trusted AI deployment globally.

Together, each of our two nations can form an AI ecosystem that is more resilient and innovative than either could achieve alone.

SCSP
Recommendations
  1. Establish a U.S.-India AI Coalition for Application and Adoption. Create a public-private partnership to prioritize the development of commercial and dual-use AI applications in sectors critical to economic and…
  2. Establish a Comprehensive U.S.–India Full-Stack AI Infrastructure and Technology Program. Launch a binational program to identify current and future integrated full-stack U.S. and Indian AI infrastructure capabilities for export.
  3. Synchronize U.S. and Indian Semiconductor Policies. Coordinate semiconductor policies to ensure supply chain resilience and technology security, including increasing access to equipment and specialized…
  4. Conduct Joint AI Labor-Market Mapping. Issue a joint forecast on AI-related workforce needs to forecast demand and align education, training, and skilling programs.
From the report
Documents
Publication

Published by the Special Competitive Studies Project. Co-publishers and external authors, where they exist, are credited in the byline above.

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